http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5365588-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2010-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5365588-B2 |
| titleOfInvention | Thermosetting resin composition and molding material and potting material using the same |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in dielectric breakdown characteristics. <P>SOLUTION: The thermosetting resin composition includes: an epoxy resin, preferably an epoxy silicone compound which is a cyclosiloxane having an organic group having at least three epoxy groups and no alkoxy group in one molecule or a compound having two or more epoxy groups in one molecule; an imidazole silane having a specific structure; an acid anhydride; and silica. The composition is preferably used as a molding material and a potting material, for example, for a flyback transformer, a condenser, and the like. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| priorityDate | 2005-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 138.