http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5364963-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5364963-B2 |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in reliability, such as of package bulging properties and peeling resistance, during reflow and in continuous moldability. SOLUTION: This resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a filler, (D) a compound represented by formula (I), and (E) an amine- base silane coupling agent. The epoxy resin is of a tetramethylbisphenol F type represented by a specific structural formula. |
| priorityDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 121.