http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5360963-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 |
| filingDate | 2008-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5360963-B2 |
| titleOfInvention | Catalyst-free metallization method on dielectric substrate surface and dielectric substrate with metal film |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a method for metallizing the surface of a dielectric substrate without using a catalyst, which achieves no pollution and high efficiency without needing external metal species at all, by a merger between an atmospheric pressure plasma process and a self-organization of a nanometric level of metal, and to provide the dielectric substrate provided with a metal film. <P>SOLUTION: This surface-metallizing method includes the steps of: introducing a hydrophilic functional group onto the surface of the dielectric substrate by plasma-treating the surface in atmospheric pressure while using a rare gas; producing an ultra-thin film by applying a complexed polymer and a precursor containing the same metal species as those in a layer to be plated, onto the surface with a liquid phase process; reducing the metal ion into an atomic metal by plasma-treating a complexed polymer film containing the metal ion at the atmospheric pressure, which has been formed through a reaction that the complexed polymer spontaneously forms a covalent bond while using the hydrophilic function group as a reaction point to form grafts of high density, and the precursor is combined with the complexed polymer through a coordinate bond; and forming a metal layer by immersing the substrate having the nanometric size of clusters thereon which have been formed by the self-organizing aggregation of the formed atomic metal, into an electroless plating bath. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| priorityDate | 2008-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.