http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5354753-B2

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-36
filingDate 2011-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-5354753-B2
titleOfInvention Underfill material and semiconductor device
abstract <P>PROBLEM TO BE SOLVED: To provide an underfill material which has low viscosity and good infiltration properties into a narrow pitch and a narrow gap and which provides a cured product having low hygroscopic nature and high adhesion to a silicon chip and a passivation film material, and a semiconductor device sealed with the cured product of the underfill material. <P>SOLUTION: The underfill material contains (A) (A-1) 50-99 pts.mass of a liquid epoxy resin and/or an epoxy compound having at least two epoxy groups per molecule and (A-2) 1-50 pts.mass of a monofunctional epoxy compound having a biphenyl structure, wherein the total of (A-1) and (A-2) is 100 pts.mass, (B) an amine-based curing agent, wherein the amount thereof is such that the molar quantity of the epoxy group in the component (A) relative to the molar quantity of the amino group in the component (B) is 0.7-1.2, (C) an inorganic filler, wherein the amount thereof is 50-300 pts.mass relative to the total 100 pts.mass of the component (A) and the component (B), and (D) silicone fine particles coated with a polyorganosilsesquioxane resin, wherein the amount thereof is 1-15 pts.mass relative to the total 100 pts.mass of the component (A) and the component (B). <P>COPYRIGHT: (C)2012,JPO&amp;INPIT
priorityDate 2011-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID163547904
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410043847
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414870254
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18819
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408721192
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393770
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID76476
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414884702
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID465137605
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412026331
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458399660
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425356381
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18360
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12111
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453797392
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456171974
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7095
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6623
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419548292
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419479223
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31217
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID62467
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393372
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415717720
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14094712
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159991
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456367111
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414883979
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20473

Total number of triples: 45.