http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5353636-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate | 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5353636-B2 |
| titleOfInvention | Semiconductor sealing resin composition and semiconductor device using the same |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor which is excellent in a balance of flowability, continuous moldability, handleability, and adhesiveness; and to provide an economic semiconductor apparatus which is prepared by sealing a semiconductor device by its cured material and is excellent in reliability. <P>SOLUTION: The resin composition for sealing a semiconductor is an epoxy resin comprising one or two or more components and is characterized by comprising: an epoxy resin (A) containing a component (A1) comprising a polymer containing a structural unit represented by formula (2); a phenol resin-based curing agent (B); and an inorganic filler (C). (In the formula, R1 independently is a 1-6C hydrocarbon group and a is an integer of 0 to 3, R6 independently is a 1-6C hydrocarbon group and b is 0 or an integer of 1 to 4, R7, R8, R9 and R10 independently are a hydrogen atom or a 1-6C hydrocarbon group). <P>COPYRIGHT: (C)2011,JPO&INPIT |
| priorityDate | 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 236.