http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5353628-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 |
| filingDate | 2009-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5353628-B2 |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of stably performing electrical connection between connection members provided at a semiconductor wafer and semiconductor chips stacked thereon, and capable of manufacturing a semiconductor-chip bonded object with a satisfactory yield, the semiconductor device manufactured by the method, a method of manufacturing an electronic component having high connection reliability, and the electronic component manufactured by the method. <P>SOLUTION: An electrically conductive connection material having a laminated structure composed of a resin composite and metal foil selected from solder foil and tin foil is interposed between a semiconductor wafer and semiconductor chips, and furthermore, the resultant object is heated to melt the metal foil. The metal foil is aggregated between connection electrodes of the semiconductor wafer and connection electrodes of the semiconductor chips, and solidified therebetween while the resin composite is also cured or solidified. Thereby, the electronic component is obtained by fastening the semiconductor wafer and the semiconductor chips to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| priorityDate | 2009-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 211.