http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5294834-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D65-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-26 |
| filingDate | 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5294834-B2 |
| titleOfInvention | Packaging material and packaging material |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a material for molding a package constituting at least a part of the package in contact with an aqueous solution containing a fat-soluble vitamins and/or alkylphenol fungicide as effective compopnents, suppressing adsorption of the effective components and having flexibility; and to provide a package at least partially constituted of the same. <P>SOLUTION: The material for molding a package constitutes at least a part of a package in contact with an aqueous solution containing a fat-soluble vitamins and/or alkylphenol fungicide, and contains a resin composition comprising a polyester resin and an ethylene ionomer resin. The package is formed using the above material for molding as a molding material at least partially constituting the package, which is in contact with the aqueous solution containing fat-soluble vitamins and/or alkylphenol fungicide. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| priorityDate | 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.