http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5293581-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2009-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5293581-B2 |
| titleOfInvention | Conductive composition, method for forming conductive wiring, and conductive wiring |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a conductive composition with which deformation of a substrate in a solid printing portion is prevented, printability at a wire portion is improved, and a conductive wiring with small specific resistance can be formed, to provide a forming method of the conductive wiring using the conductive composition, and to provide the conductive wiring. <P>SOLUTION: The conductive composition contains a silver powder (A), second class fatty acid silver salt (B) obtained using second class fatty acid with a boiling point of 180°C or less, and a solvent (C). The silver powder (A) is a spherical silver powder of the average particle size of 0.7-5 μm, and the content of the silver oxide is 10 parts by mass or less against the solvent (C) of 100 parts by mass. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| priorityDate | 2009-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.