http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5292930-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate | 2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5292930-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is satisfactory in burning resistance without using brominated epoxy resin or an antimony compound and is superior in the balance between fluidity and anti-solder property. <P>SOLUTION: The semiconductor sealing epoxy resin composition, which contains an epoxy resin (A) of a specified structure having a glycidyl ether, a curing agent (B) and an inorganic filler (C), is characterized in that the ratio of curing torque value after 120 sec after start of measurement to maximum curing torque value in the time until 300 sec, after start of measurement is in the range of 70% or more when measuring the curing torque of the epoxy resin composition in time series at a mold temperature of 175°C with a curastmeter; and the semiconductor device is characterized by being formed by sealing with a cured matter of this epoxy resin composition. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| priorityDate | 2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 187.