http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5291008-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2009-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5291008-B2 |
| titleOfInvention | Method for manufacturing circuit wiring board |
| abstract | Disclosed is a process for producing a circuit wiring board comprising a step (S1) of coating a coating liquid containing a polyimide precursor resin and a metal compound onto a base material to form a coating film, a step (S2) of forming a resist mask pattern on a surface of the coating film, a step (S3) of reducing metal ions in the coating film to form a metal deposit layer, a step (S4) of forming a circuit wiring having a pattern by plating on the metal deposit layer, and a step (S5) of heat treating the polyimide precursor resin layer to imidate the polyimide precursor resin and thus to form a polyimide resin layer. |
| priorityDate | 2008-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.