http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5290659-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2008-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5290659-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation of power module and power module |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing providing high tracking resistance even when an amount of an inorganic filler is comparatively small and to provide a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition for sealing containing an epoxy resin, a curing agent, a curing promotor and the inorganic filler as indispensable components, contains an aminotriazine-modified novolac resin and a melamine resin as the curing agent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| priorityDate | 2008-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.