http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5277609-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-10 |
| filingDate | 2007-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5277609-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, which is excellent in flowability when molded, mold releasability, continuous moldability, low moisture absorbability and low stress property of a cured resin, and balance of adhesive force to metal-based members, and gives semiconductor devices excellent in solder reflow resistance. <P>SOLUTION: This epoxy resin composition for sealing the semiconductors, comprising (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) (E-1) a trimethylolpropane trifatty acid ester, and/or (E-2) a composite full ester of trimethylolpropane with a fatty acid and a dicarboxylic acid is characterized in that (A) the epoxy resin comprises at least one epoxy resin selected from (A-1) a phenol aralkyl type epoxy resin or naphthol aralkyl type epoxy resin which have a phenylene skeleton, a biphenylene skeleton or a naphthylene skeleton, (A-2) a biphenyl type epoxy resin, and (A-3) a bisphenol type epoxy resin, or (B) the phenolic resin-based curing agent comprises (B-1) a phenol aralkyl resin or a naphthol aralkyl resin which have a phenylene skeleton, a biphenylene skeleton or a naphthylene skeleton. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| priorityDate | 2006-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.