http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5277569-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 |
| filingDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5277569-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which can enhance the yield and the quality of a semiconductor device on compression molding, when the semiconductor elements is sealed by a compression molding method, to manufacture the semiconductor device. <P>SOLUTION: The present invention relates to a granular epoxy resin composition for sealing a semiconductor, used for sealing a semiconductor element by a compression molding method to produce a semiconductor device, characterized by containing coarse granules of ≥2 mm in a rate of ≤3 wt.% and a fine powder of <106 μm in a rate of ≤7 wt%, and to the semiconductor device prepared by sealing a semiconductor element with the epoxy resin composition. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| priorityDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.