http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5273443-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2008-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5273443-B2 |
| titleOfInvention | Method for forming minute solder bump and solder paste |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a method for forming a micro solder bump and a solder paste for use in forming this micro solder bump. <P>SOLUTION: In the method for forming the micro solder bump, the solder paste which contains a flux of 5-20 mass% not containing an activator, and in which the remnant is made of a solder alloy powder having a mean particle size of 5 μm or less is coated, an activator containing activated material in which the activator is melted in a solvent is coated on this coated solder paste, and subsequently a reflow process is performed. The solder paste is used for forming the micro solder bump which contains the flux of 5-20 mass% not containing the activator, and in which the remnant is made of the solder alloy powder having the mean particle size of 5 μm or less. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| priorityDate | 2008-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.