http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5269934-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-12 |
| filingDate | 2011-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5269934-B2 |
| titleOfInvention | Thermoplastic resin composition for foam molding excellent in light resistance and foam-molded product thereof |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for foam-molding, having excellent formability in foam extrusion, capable of providing foam-molded product suitable for die-cutting processing such as Victorian die-cutting, and having excellent light resistance, and to provide a molded product thereof. <P>SOLUTION: The thermoplastic resin composition for foam-molding, having excellent light resistance is obtained by compounding 100 pts.wt. of a rubber-reinforced styrene-based resin containing a copolymer (A) obtained by copolymerizing an aromatic vinylic monomer with a vinyl cyanide-based monomer, and optionally other monomers copolymerizable with the monomers, and a graft copolymer (B) obtained by grafting an aromatic vinylic monomer, a vinyl cyanide-based monomer, and optionally other monomers copolymerizable with the monomers in the presence of a gummy polymer having a weight averaged particle diameter of 0.3-3 μm, with 0.01-0.5 pts.wt. of an organopolysiloxane (C) having a viscosity of 50-1,000 cSt measured at 25°C, 0.05-0.8 pts.wt. of a hindered amine-based light stabilizer (D), and 0.1-2 pts.wt. of a metal salt (E) of a higher fatty acid, having a melting point of ≤140°C. The thermoplastic resin composition has ≤1.0 wt.% of oligomer components having a weight averaged molecular weight of 200-1,000, and a melt tension of ≥30 g measured at 200°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| priorityDate | 2011-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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