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filingDate 2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-5259383-B2
titleOfInvention Semiconductor device and semiconductor system
abstract <P>PROBLEM TO BE SOLVED: To improve reliability and manufacturing yield of a POP type semiconductor device constituting a system by stacking a second semiconductor package on a first semiconductor package. <P>SOLUTION: The POP type semiconductor device is constituted by stacking the second semiconductor package including a printed circuit board, on which a DRAM chip and a flash memory chip are mounted, on the first semiconductor package 100 including the printed circuit board 101 on which a controller chip is mounted. In this POP type semiconductor device, a lower surface side land 115d for DRAM chip interface of the first semiconductor package 100 is arranged in the outermost circumference of the lower surface of the printed circuit board 101 and a via wiring 113d for DRAM chip interface is arranged in the external side of an upper surface side land 112d for DRAM chip interface in order to achieve the shortest wiring length of the route extending to the lower surface side land 115d from the controller chip 102. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT
priorityDate 2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 38.