http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5251392-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3417 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2008-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5251392-B2 |
| titleOfInvention | Epoxy resin molding material for sealing and electronic component device |
| priorityDate | 2007-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 363.