http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5223184-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2006-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5223184-B2 |
| titleOfInvention | Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, and semiconductor package |
| priorityDate | 2006-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 269.