http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5178308-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate | 2008-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5178308-B2 |
| titleOfInvention | Thermosetting solder resist composition, solder resist layer comprising the cured product, and printed wiring board |
| priorityDate | 2008-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 138.