http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5170477-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2009-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5170477-B2 |
| titleOfInvention | Copper wiring surface protective liquid and method for manufacturing semiconductor circuit element |
| priorityDate | 2008-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.