| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1696
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2007-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-5149805-B2 |
| titleOfInvention |
Electroless copper plating method |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102573184-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230101602-A |
| priorityDate |
2006-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |