http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5122892-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2007-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5122892-B2 |
| titleOfInvention | Method of manufacturing die bonding paste for light emitting diode |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a die bonding paste for use of a light-emitting diode, which suffers a small change with time under high temperature environments and gives a hardened substance excellent in heat resistance and durability. <P>SOLUTION: The die bonding paste for use of a light-emitting diode contains: (A) a liquefied reactant including (a-1) glycidylamine-type liquefied epoxy resin and (a-2) bismaleimide-group-containing polyimide resin of a number average molecular weight of 200-10,000 which are thermally reacted at a temperature of 120-220°C for 0.5-5 hours; (B) an amine-based hardening agent, (C) a conductive filler; (D) an imidazole-based hardening accelerator; and (E) a reactive diluent and/or organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| priorityDate | 2007-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.