http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5117416-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2009-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5117416-B2 |
| titleOfInvention | Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board |
| priorityDate | 2009-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 121.