http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5107960-B2
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate | 2009-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2012-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2012-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-5107960-B2 |
titleOfInvention | Solder resist composition, dry film and printed wiring board using the same |
priorityDate | 2009-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 679.