http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5085306-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5085306-B2 |
| titleOfInvention | Resin composition for underfill, printed circuit board, and electronic device |
| priorityDate | 2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.