| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
2010-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-5079883-B2 |
| titleOfInvention |
Copper foil for printed wiring board excellent in heat discoloration resistance and etching property, and laminate using the same |
| priorityDate |
2010-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |