http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5066376-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2007-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5066376-B2 |
| titleOfInvention | Solder resist composition for printed wiring board and printed wiring board |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a liquid resin composition capable of reducing the discoloring of a white coating film, due to UV irradiation and a thermal history, and the lowering of reflectance, and forming a pattern with a low amount of exposure. <P>SOLUTION: The photosensitive resin composition contains: (A) an active energy line curing resin which is obtained from alicyclic epoxy resin and has at least two ethylene unsaturated bonds in one molecule; (B) a thiol compound, (C) a photopolymerization initiator, (D) a diluent, (E) rutile type titanium dioxide, and (F) an epoxy thermosetting compound. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| priorityDate | 2007-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.