abstract |
<P>PROBLEM TO BE SOLVED: To provide a mounting board which enables high density mounting without using an area right above a filled-via as an area only for placing a solder ball. <P>SOLUTION: The mounting board comprises a substrate having a blind hole with one side open and the other side closed, a conductive material with which the blind hole is filled, and a semiconductor mounting part electrically connected to the conductive material by wire bonding. <P>COPYRIGHT: (C)2008,JPO&INPIT |