patent/JP-5039707-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5039707-B2

Outgoing Links

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filingDate	2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2012-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2012-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-5039707-B2
titleOfInvention	Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal-clad laminate, printed wiring board, and multilayer printed wiring board
priorityDate	2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate

Subject

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003147166-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003334886-A

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Total number of triples: 76.