http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5011952-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5011952-B2 |
| titleOfInvention | Method for forming metal vapor deposition layer pattern and method for manufacturing circuit board |
| priorityDate | 2005-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.