http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5000259-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 |
| filingDate | 2006-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5000259-B2 |
| titleOfInvention | Transparent sealing material |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a resin composition curable by condensation reaction, excellent in transparency and heat resistance, and also in thermal stability, hardness(curability) and adhesiveness to substrate, thus suitable to light-emitting diode element-processing applications including transparent sealing materials and adhesives. <P>SOLUTION: The resin composition comprises an acrylic resin, a condensation-reactive silicone compound and/or a condensation-reactive silane compound and a curing promoter, wherein the total amount of the condensation-reactive silicone compound and the condensation-reactive silane compound is 250-2,000 pts.wt. based on 100 pts.wt. of the acrylic resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| priorityDate | 2006-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.