| abstract |
The present invention provides a white curable composition for an optical semiconductor device, which can obtain a molded article excellent in processability and can further improve the adhesion of the molded article to a lead frame. A white curable composition for a semiconductor device according to the present invention includes an epoxy compound, a curing agent, titanium oxide, a filler different from titanium oxide, and a curing accelerator. 1 g of the above-mentioned white curable composition for optical semiconductor devices before thermosetting is placed in 10 g of a liquid containing 5 g of acetone and 5 g of pure water, heated at 80 ° C. with stirring for 1 hour, and then in the liquid after heating. When an insoluble component is removed by filtration to obtain an extract, the pH of the extract is 3 or more and 6 or less. When 1 g of cured product after being cured by heating is used to obtain an extract in the same manner as described above, the pH of the extract is 6 or more and 7 or less. [Selection] Figure 1 |