| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate |
2005-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4977962-B2 |
| titleOfInvention |
Chemical mechanical polishing pad, manufacturing method thereof, and chemical mechanical polishing method of semiconductor wafer |
| priorityDate |
2004-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |