http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4973322-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-10 |
| filingDate | 2007-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4973322-B2 |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in heat dissipation, flowability, and soldering resistance and can significantly suppress the change of a warp in each step to which a semiconductor device is subjected by the time it is mounted in a printed circuit board, and to provide a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition used for sealing a semiconductor device comprises an epoxy resin (A), a phenol resin-based curing agent (B), an inorganic filler (C) and a release agent (D), wherein the phenol resin-based curing agent (B) comprises a triphenol-methane type phenol resin; the inorganic filler (C) comprises spherical alumina; and the release agent (D) comprises a glycerol trifatty acid ester. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| priorityDate | 2007-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.