http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4972220-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4972220-B1 |
| titleOfInvention | Prepreg for electronic parts |
| abstract | Provided is a prepreg capable of improving workability and voltage resistance after curing. The present invention relates to a prepreg 1 in which a base material 10 is impregnated with a thermosetting composition 2. The thermosetting composition 2 includes a thermosetting compound. The base material 10 is a base material that is not a woven fabric. The base material 10 has a plurality of first resin threads 11 extending in the first direction and a plurality of second resin threads 12 extending in a second direction intersecting the first direction. The first resin thread 11 and the second resin thread 12 are laminated. The first resin thread 11 and the second resin thread 12 are integrated at the intersection. The material of the first resin thread 11 and the second resin thread 12 is a polyolefin resin. [Selection] Figure 1 |
| priorityDate | 2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.