http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4962149-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C12-00 |
| filingDate | 2007-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4962149-B2 |
| titleOfInvention | Solder paste and bonded article |
| priorityDate | 2007-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.