| abstract |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which is high in adhesiveness to resin mold and is provided with a metal post superior in long-term reliability, to provide a semiconductor device using the wiring board provided with the metal post, to provide a semiconductor device module, and to provide a manufacturing method therefor. <P>SOLUTION: The wiring board 101 is provided with a base 10 which is comprised of at least one wiring layer and at least one insulation layer, and a plurality of metal posts 11 provided on one surface of the base 10. In this case, at least one metal post 11 is provided with at least one convex in longitudinally sectional shape, and it is an irregular post, which has at least one concave or one convex in laterally sectional shape at least in a part in the direction of its height. <P>COPYRIGHT: (C)2008,JPO&INPIT |