http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4935972-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2005-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4935972-B2 |
| titleOfInvention | Composition for optical semiconductor encapsulation, method for producing the same, and optical semiconductor encapsulant |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an optical semiconductor-encapsulating composition giving an optical semiconductor-encapsulating agent which is used for potting, colorless, transparent, durable and not liable to crack for solder reflow and heat cycle. <P>SOLUTION: The optical semiconductor-encapsulating composition contains (A) a polyorganosiloxane having an epoxy group with an epoxy equivalent of 150-600 g/mole, a glass transition temperature of -80°C-150°C and a polystyrene-converted weight average molecular weight of 500-1,000,000 and (B) a polyorganosiloxane having an epoxy group with an epoxy equivalent of over 600 g/mole and not more than 1,600 g/mole, a glass transition temperature of not higher than -50°C and a polystyrene-converted weight average molecular weight of 500-1,000,000. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| priorityDate | 2005-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 197.