Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09536 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
filingDate |
2005-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2012-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2012-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-4915639-B2 |
titleOfInvention |
Multilayer printed wiring board and manufacturing method thereof |
priorityDate |
2005-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |