http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4877716-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4877716-B2 |
| titleOfInvention | Curing agent for fast-curing epoxy resin and epoxy resin composition |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an excellent one pack-type epoxy resin composition having both of extremely high rapid curability and storage stability at normal temperature; to provide a latent curing agent for obtaining the composition; and to provide an anisotropic electroconductive material, an electroconductive adhesive material, an insulation adhesive material, an encapsulant or the like providing high reliability of connection and high sealing properties even under a curing condition of a low temperature or a short time. <P>SOLUTION: The microcapsule-type curing agent for an epoxy resin is obtained by microencapsulating a curing agent for the epoxy resin characterized by >1 and ≤7 molecular weight distribution defined by the ratio of the weight average molecular weight to the number average molecular weight of an amine adduct, >1 and ≤10 pts.mass content of a low-molecular weight amine compound (B) based on 100 pts.mass of the amine adduct (A), and a melt viscosity of from 0.1 mPa s to 30 Pa s of the curing agent for the epoxy resin at 140°C. The epoxy resin composition contains the curing agent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| priorityDate | 2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 425.