http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4876653-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate | 2006-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4876653-B2 |
| titleOfInvention | Epoxy resin composition for light emitting device sealing material |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for light-emitting device-sealing material, very good in balance between moisture resistance, heat resistance and light resistance and giving its cured product with excellent colorless transparency, in particular useful as a sealing material for LEDs emitting short-wavelength light. <P>SOLUTION: The epoxy resin composition for light-emitting device-sealing material comprises (A) an epoxy resin of the general formula(1)( wherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each H, a 1-4C alkyl or halogen atom; and n is 0-40 ) and (B) an acid anhydride compound and/or a cationic polymerization initiator. In this resin composition, the epoxy resin is such that the light transmittance(for 400 nm wavelength light) of a solution prepared by dissolving the epoxy resin in a ketone solvent so as to be 80 mass% in its concentration is 80% or greater, measured using a spectrophotometer with a quartz cell 1 cm in optical path length. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| priorityDate | 2006-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 173.