http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4863032-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2000-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4863032-B2 |
| titleOfInvention | Processing method of thin plate-like article, manufacturing method of connection substrate using the processing method, manufacturing method of connection substrate and multilayer wiring board, manufacturing method of multilayer wiring board and semiconductor package substrate, manufacturing of semiconductor package substrate and semiconductor package Method and semiconductor package |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I685082-B |
| priorityDate | 2000-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.