patent/JP-4847415-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4847415-B2

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
filingDate	2007-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-4847415-B2
titleOfInvention	Wafer level packaging method using low aspect ratio wafer through-holes
priorityDate	2006-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458431511 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23939

Total number of triples: 63.