| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2005-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4839629-B2 |
| titleOfInvention |
Film adhesive, adhesive sheet and semiconductor device using the same |
| abstract |
<P>PROBLEM TO BE SOLVED: To provide a film-like adhesive sufficiently satisfying both processability such as fillability to an adherend, low temperature laminatability and the like and reliability of a semiconductor device such as reflow resistance and the like. <P>SOLUTION: The film-like adhesive is used for bonding a semiconductor element to an adherend and has an adhesive layer comprising an adhesive layer containing a polyurethane-imide and a polyurethane-amide-imide copolymer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| priorityDate |
2005-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |