| abstract |
A metal layer (44, 45, 64) is formed on an upper surface of a resin layer provided to cover a plurality of semiconductor chips (11) at a side on which an internal connecting terminal is disposed and the internal connecting terminal (12), and the metal layer is pressed to cause the metal layer in a corresponding portion to a wiring pattern (14, 15) to come in contact with the internal connecting terminal, and to then bond the metal layer in a portion provided in contact with the internal connecting terminal to the internal connecting terminal in a portion provided in contact with the metal layer. |