http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4814551-B2
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
filingDate | 2005-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-4814551-B2 |
titleOfInvention | Thermosensitive adhesive and adhesive material |
abstract | <P>PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive and a heat-sensitive adhesive material solving drawbacks seen in conventional heat-sensitive adhesives and excellent in tackiness to rough surfaces such as of corrugated boards and blocking resistance, particularly, to provide such a heat-sensitive adhesive and a heat-sensitive adhesive material causing no peeling off corrugated boards with the lapse of time. <P>SOLUTION: The heat-sensitive adhesive essentially comprising a thermoplastic material and a hot-melt material that melts on heating, wherein the hot-melt material includes a polymeric hot-melt material that is obtained by copolymerization between, as the essential components, (a) at least one benzophenone-based monomer selected from the compounds of the formula(1) and (b) a vinyl monomer copolymerizable therewith. <P>COPYRIGHT: (C)2007,JPO&INPIT |
priorityDate | 2005-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 251.