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filingDate 1999-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-4766725-B2
titleOfInvention Manufacturing method of electronic parts
abstract A method of manufacturing an electronic component includes providing a substrate (101), forming a semiconductor device in the substrate (101), depositing a metal layer (107) over the substrate (101) and electrically coupled to the semiconductor device, depositing a layer (108) of solder over the metal layer, and wire bonding a wire (109) to the metal layer (107).
priorityDate 1998-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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