http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4762423-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate | 2001-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4762423-B2 |
| titleOfInvention | Void-free copper plating method |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10512174-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10508357-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9598787-B2 |
| priorityDate | 2001-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 241.