http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4750486-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2005-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4750486-B2 |
| titleOfInvention | Electrolytic copper plating additive, electrolytic copper plating bath containing the additive, and electrolytic copper plating method using the plating bath |
| priorityDate | 2005-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.