http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4748519-B2
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 |
filingDate | 2006-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2011-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2011-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-4748519-B2 |
titleOfInvention | Ultra thin copper foil with carrier, manufacturing method thereof, printed wiring board using ultra thin copper foil with carrier |
priorityDate | 2002-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.